DESCRIPTION:
SEMICAPS SOM is a scanning optical microscope used for fault localization of integrated circuits using laser induced phenomena. It is an integrated compucentric system designed for maximum ease of use and flexibility. The system is optimized for high laser power delivery, sensitivity and spatial resolution. The open architecture of the system allows the application of current and future laser induced techniques. The modular design facilitates customization according to user requirements SEMICAPS offers 2 types of SOM configurations for industrial use, the Analytical (Upright/Inverted) and the Tester Docked (Inverted) systems. The systems are designed for OBIC, SCOBIC, LIVA, TIVA, SEI, OBIRCH and pulsed laser technique and are upgradable for future techniques. The system uses a 1064nm and a 1340nm laser. The 1064nm laser is capable of electron-hole pair generation through backside silicon while the 1340nm laser is a high resolution thermal probe which allows localized heating. The laser multiplexer provides seamless selection, attenuation and blanking of the two lasers. SEMICAPS microscope module is custom designed to provide maximum flexibility for the optical components required for various techniques. Included in the microscope module is a motorized detector selector, two 3-position optical component turrets and a 5-position objective turret. The system comes with an auxiliary signal port, which has a proprietary hardware averager capable of 1 million sample averaging.
BASIC TECHNICAL DATA:
Multi-laser Capability
The standard SEMICAPS SOM system uses two near-IR lasers. The 1064nm laser is capable of efficient electron-hole pair generation through backside silicon while the 1340nm laser is a high resolution thermal probe which allows localized heating. The laser multiplexer provides seamless selection, attenuation and pulsing of the lasers. Additional laser can be integrated into the system.
High laser power delivery
The laser power on the device is greater than 30mW for all conventional long working distance objective
High resolution laser scan image resolution is up to 2048x2048. The spatial resolution is less than 0.75um for 1064nm laser using a conventional long working distance objective. Higher spatial resolution can be achieved using the Solid Immersion Lens (SIL) option or Diffractive Lens option
Multi-technique capability
The system is compatible with the following thermal stimulation techniques: OBIRCH, TIVA, SEI, TBIP, DReM, SDL-RIL, and the following carrier generation techniques: OBIC, SCOBIC, LIVA and LADA. The system is also upgradable for future laser induced techniques
TV-Rate camera for navigation
The system incorporates a TV-rate navigation camera for real-time backside imaging to complement the laser scan module
Multi-detector capability
The microscope module is custom designed to provide maximum flexibility for the optical components required for various detectors and sources. Optional detectors like Si-CCD, InGaAs, IREM, MCT and Laser Marker can be mounted on the system.
High resolution stage
The system comes with linear servo and linear encoder stages with 20nm resolution and repeatability better than 0.5um. The linear servo mechanism allows users to move the stages with minimal vibration
Proprietary laser induced signal digitization hardware
The system comes with a proprietary digitization hardware capable of providing the average, sum and string of values. The summing and averaging modules are capable of 1 million samples and more than 8000 string values
Flexible system configurations
SEMICAPS SOM is offered in various configurations: analytical, inverted analytical, upright and inverted tester docked models
OPTICAL FAULT LOCALIZATION SYSTEM [SEMICAPS SOM]
1. Photon Emission Microscopy Option - Integration of PEM camera module onto the SOM system
- Si-Cooled CCD Camera Module
- InGaAs Camera Module (TE-Cooled, LN2 Cooled)
- MCT Camera Module
2. Probe Station Integration Option
- SEMICAPS Probe Station (300mm)
- Suss Probe Station
- Cascade Probe Station
- Signatone Probe Station
3. Silicon Immersion Lens (SIL) Option
4. Laser Marker Module
5. Heating/Cooling Chucks
6. Laser Sources
NIR 1064nm, 500mW
NIR 1340nm, 500mW
7. Laser Multiplexer
Fully software controller
Laser & laser power selection
Laser shutter linked to door interlock
Laser chopper
8. Navigation Camera
Monochrome, high sensitivity
1/2" interline transfer CCD
537H x 505V (EIA)
Horizontal Resolution, 400(H) x 360(V) TV lines
S/N Ratio, >46dB (AGC Off)
9. Laser Scan Module
Resolution, 64, 128, 256, 512,1024, 2048
Frame Mode, 512 x 512 pixel: 1.6, 3, 6, 12 s/frame
Frame Mode, 1024 x 1024: 6.4, 12, 24, 48 s/frame
Point Mode: access time is per 75 us per pixel
Scan Area, 5X: 3.6mm x 3.6mm; 100x: 0.09mm x 0.09mm
Power Delivery: >30mW at DUT for 100X 0.85 NA objective for both lasers
10. Microscope Module
NIR Optical Microscope; Hallogen Illuminator,Computer-Controlled
Selectable Intensity
Turret, 5 Position, Motorized, Computer-Controlled
Objectives, 2.5X, 5X, 20X, 50X 100X, Computer-controlled selectable
11. DUT/Stage Module
XY Stage, 100x100mm, 20nm step, 0.5um repeatability
Motorized, Computer-Controlled
Joystick Control for XYZ Movements
Sample Holders, Platen, Adjustable for 50-200mm samples
Auxiliary Port
12. Computer System
Industrial PC, CPU, 512MB RAM, 80GB HDD,
DVD R/W, 3.5" FDD, 4 RS-232 ports Ethernet card,
parallel port, USB ports, keyboard & mouse
17" LCD monitor, Windows (TM) 2000/XP OS
13. Software
Integrated Windows-based Software, Image Capture Module,
Image Archiving and Browsing, Image Printing, Print Template,
Multiple Image Format Support, Focusing & DUT Positioning,
Advanced Image Processing Module inlcuding Digital Zoom,
Annotation, Brightness, Contrast, Gamma Adjustment, Noise Reduction
(3 levels), Sharpening (3 levels), Smoothing (3 levels), Edge Enhancement
(3 levels), Mosiac, Histogram Equalization