LASER DECAPER

DESCRIPTION:

• Automatic laser decapsulation system
• All types of semiconductor package can be removed 
• Any material (Au, Cu, Al) of wire part and 2nd bonding area can be opened  
• Effective decapsulation solution for Cu wire chip: Minimize   the damage on Cu wire by chemical etching after laser   operation
• A few hundred microns of EMC on die surface can be   opened with chemical etching (by manual or MIS Wet Etch: Minimal acid use) 
• Easy, simple, fast and safe operation
       > Vision camera provides real time image 
       > User can set the decap area by mouse drag / numerical value input 
       > User can see laser decapsulation process & result on monitor screen 
       > Superimposing X-ray image on real-time sample picture is available 
       > Auto door lock : System door is not opened during laser operation 
       > Automatic Z axis adjustment by PC program  
• User can observe the operation process through the window (protected from laser radiation) 
• Repetitions made simple using recipe files 
• Fume & Dust can be exhausted (Option: Fume & Dust   collector)

BASIC TECHNICAL DATA:

Applications:

semiconductor has a failure, the first thing is to conduct a non-destructive testing. The non-destructive testing is commonly carried out for an analysis by X-Ray, ultrasound, electrical tests. But for defects that are not detected even by the non-destructive test, destructive testing must be conducted. The first step of the destructive testing in this case is "Decap". The typical semiconductor has a molding with an epoxy to protect the circuit. The operation for the physical and chemical removal of the molding is referred to as "Decap". Mis Laser Decaper Decap is a system that performs this process automatically using laser.