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Laser Repair for 6-, 8- and 12-inch Wafer with Built-in Laser Theta

Extremely compact, versatile, easy to use with user-friendly software, the Model LRS-2400 is available in both tabletop and console configurations.

Inspection Systems generate defect data files and from these data files, engineers have to locate the physical defect for further study. The task becomes impossible or unbearable when dealing with large wafers or large dies that have sub-micron features. LRS-2400 reads the defect data and navigates to the exact location of the defect. With a high-power microscope, the user can perform tasks as highlighted in the feature section below. Using a simple, compact, triple wavelength Nd: Yag Laser System, the Model LRS-2400 performs laser-cutting operations for design verification, wafer failure analysis, and repair.


Standard Configuration:

  • Review defects with Auto-search
  • Re-classify defect categories

With Laser Option:

  • Re-locate defect in SEM/FIB
  • Repair defects

Other Features:

  • Built in frame grabber
  • Available Defect Formats: KLA-Tencor: KLARF, TFF
  • Flexible Script Language
  • Remote interface facilities
  • Probing platform-ready

Highly Sensitive Microscope and NIR Objectives

When performing failure analysis, if, after initial review under a high-power microscope, further analysis is necessary, the next step required is a cross section and study of the defects.ÊÊ The obstacle in this process is getting back to the defect location in an FIB for cross sectioning, or SEM for furthr study. Locatying the defects can take considerable time, if it is possible to locate them at all. Time and money spent on cross sectioning is a burden most users would prefer to avoid. The solution to this problem is laser marking.

The LRS-2400 reads the defect data and navigates to the exact location of the defect.Ê The user would activates the top-mounted Laser to mark the location. ÊThe laser marks would be easily spotted under FIB/SEM low magnification setting.Ê By setting the marks at the center field of view and then zooming in, the FIB/SEM operator can precisely locate the defect location—in seconds



  • Travel Distance: 8" x 8" up to 12" x 12"
  • Accuracy: +/- 5 µ
  • Accuracy Resolution: 1 µ
  • Chuck Diameter: 8" up to 12"

Laser Head:

  • Wavelength:
      Nd: YAG Laser
  • Pulse Width: 7 nanosecond
  • Energy: .6mJ
  • Cooling: Ambient air
  • Beam Mode: TEMoo (Single Mode


  • Latest processor with plenty of RAM for fast image processing
  • Built-in Frame Grabber with image capture facilities in various formats

Other Specifications:

  • 50X Objective 50 x 50 um max.; 1.2 x 1.2 um min.
  • 100X Objective: 0.6 x 0.6 um min.
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